All-in-one Automatic Molecular Sieve Filler: Punch, fill, seal, done

The first critical step in molecular sieve processing is creating precise access points for filler injection—without compromising the structural integrity of the target component (e.g., hollow glass aluminum spacers, adsorption towers, or catalyst reactors). The all-in-one automatic filler’s punching module is engineered to address this challenge through advanced mechanical design and intelligent control systems.

Unlike manual punching, which often results in irregular hole sizes, burr formation, or material deformation, the automated punching mechanism leverages servo-driven actuators and precision tooling to deliver consistent, repeatable results. For instance, in hollow glass production, the system targets aluminum spacers (6–24mm in width) with punch diameters calibrated to match molecular sieve particle sizes (0.5–0.8mm), ensuring unobstructed filler flow while minimizing post-processing debris. The punching process is synchronized with component positioning systems, which use optical sensors to align the punch with pre-programmed coordinates—eliminating human error and ensuring hole placement accuracy within ±0.1mm.

Notably, the module’s adaptability is a key strength. It accommodates diverse component geometries, from straight aluminum strips to custom-bent frames (square, rectangular,弓形, or rounded-corner designs) and cylindrical adsorption towers, making it suitable for multiple industrial sectors . Advanced models also feature adjustable punch depth and force control, preventing material damage while maintaining structural integrity—a critical consideration for thin-walled components or high-pressure applications like gas separation reactors.